Microfabrication

Numbering Code G-ENG06 5G204 LJ51 Year/Term 2022 ・ First semester
Number of Credits 2 Course Type Lecture
Target Year Target Student
Language English Day/Period Mon.4
Instructor name TSUCHIYA TOSHIYUKI (Graduate School of Engineering Professor)
URABE KEIICHIRO (Graduate School of Engineering Assistant Professor)
HIROTANI JUN (Graduate School of Engineering Associate Professor)
Outline and Purpose of the Course Micro/nano fabrication processes and materials used to realize micro/nano systems are described. Topics will be photolithography, dry-etching, thin-film deposition, which includes bulk micro machining, surface micro machining and further advanced polymer processing.
Course Goals To obtain fundamental knowledge about design and fabrication of micro/nano systems and to be familiar with recent fabrication technologies and micro/nano systems.
Schedule and Contents Week 1: introduction
・ Microfabrication and devices
Week 2 to 4: Advanced semiconductor device fine processing technology
・ Front-end process flow
・ Photolithography basics and recent topics
・ Plasma etching
Week 5 to 7: Basics of semiconductor physics and device application
・ Basics of semiconductor physics
・ PN junction, metal-semiconductor junction
・ Nanocarbon material and device
Week 8 to 9: Silicon and micromaterials
・ Mechanical properties of silicon
・ Evaluation of mechanical properties of micro-scale materials
Week 10 to 11: Silicon micromachining
・ Processing process based on semiconductor fine processing technology
・ Bulk and surface micromachining
Week 12 to 14: Basics of Applied Devices
・ Electrostatic transducers and its application
・ Piezoresistive effect and its application
・ Sensors / actuators
Week 15: feedback on evaluations such as reports
Evaluation Methods and Policy Evaluated by homework. All report must be submitted to obtain credits.
Course Requirements None
Study outside of Class (preparation and review) Follow reports and other instructions from each person in charge.
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